JPH06821Y2 - 半導体装置の実装構造 - Google Patents

半導体装置の実装構造

Info

Publication number
JPH06821Y2
JPH06821Y2 JP1987195704U JP19570487U JPH06821Y2 JP H06821 Y2 JPH06821 Y2 JP H06821Y2 JP 1987195704 U JP1987195704 U JP 1987195704U JP 19570487 U JP19570487 U JP 19570487U JP H06821 Y2 JPH06821 Y2 JP H06821Y2
Authority
JP
Japan
Prior art keywords
conductor
semiconductor device
insulating resin
protective plate
protruding electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987195704U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01100443U (en]
Inventor
正義 菊地
和夫 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP1987195704U priority Critical patent/JPH06821Y2/ja
Publication of JPH01100443U publication Critical patent/JPH01100443U/ja
Application granted granted Critical
Publication of JPH06821Y2 publication Critical patent/JPH06821Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1987195704U 1987-12-25 1987-12-25 半導体装置の実装構造 Expired - Lifetime JPH06821Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195704U JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195704U JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPH01100443U JPH01100443U (en]) 1989-07-05
JPH06821Y2 true JPH06821Y2 (ja) 1994-01-05

Family

ID=31486366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195704U Expired - Lifetime JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JPH06821Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5589314B2 (ja) * 2009-06-25 2014-09-17 株式会社リコー 電子部品モジュールの製造方法
JP6304700B2 (ja) * 2016-09-26 2018-04-04 株式会社パウデック 半導体パッケージ、モジュールおよび電気機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437473B2 (en]) * 1971-09-09 1979-11-15
JPS61220346A (ja) * 1985-03-26 1986-09-30 Toshiba Corp 半導体装置とその製造方法

Also Published As

Publication number Publication date
JPH01100443U (en]) 1989-07-05

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